There is no need to damage the protective resin on the circuit board, so the defective area in the circuit board can be accurately identified. Furthermore, because both penetrating X-ray images and fluorescence X-ray images can be viewed simultaneously, information about internal elements can also be checked, providing useful information for deducing and identifying the cause of the problem.
Analysis of Defects in Resin Moulds
Analysis of IC Package Defects
Analysis of Defects in Condensers, LEDs, etc.
Example
If the circuit board is disassembled, it will be impossible to analyze
the conditions of the
defects.
Analyze a defect inside a digital camera battery.
With electronic parts encased in moulded plastic, the external appearance of the parts provides no information about the internal circuit structure. With the XGT, however, penetrating X-ray images can be used to check the internal structure.
After the location of the defect has been identified, fluorescence X-ray images can be used to analyze the part's interior and deduce the cause of the defect.
Internal Observation Using Penetrating Images
Mapping Results
RGB-synthetic image
(Cu + Au +
Pb)
